As per the title really.
The standard USA sourced board and case is 4" wide.
Unfortunately the rest of the world uses metric, and has done for a few decades, which means 100mm is what we buy over here which is slightly narrower (by 1.6mm) than a 4" board (and one hell of a lot cheaper than trying to import a USA 4" case and/or paying the extra for custom PCBs that are 101.6 wide, all the PCB fabrication places I use do metric only).
Because all my add-on boards are, inevitably 100mm, to stay "legal" I have to use a genuine V3.0 board in my case.
So, can i just mill 1.6 mm off the side(s) ?
There is nothing obvious on the outer layers that would suggest this would be a problem but I haven't a clue what the two inner layers are - presumably power and ground layers - but how far does the copper extend to the edges of the PCB ?
Would I be best taking 1.6mm off one side, 0.8mm off both sides, but would either expose the inner planes/traces and short out ground and/or power to the slots in the case ???
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